Equipment and infrastructure
Our factory is currently capable of processing sheet-to-sheet (S2S), large-area
flexible substrates laminated on glass carriers of Gen 3.5 size (650 x 780 mm²).
We offer the following flexible electronics manufacturing expertise:
- Simulation, design and layout
- Large-area, distortion-free lamination
- Wet coating deposition
- Multi-layer alignment
- Ovens for climatic and operational reliability tests
- Patterning (2D and 3D)
- Assembly and encapsulation
- Electrical characterization
- Physical failure analysis laboratory
- Last generation test, repair and metrology tools
The key to your flexible electronics project
Whether you are a research institution, a start-up, an SME or an industrial organization, contact us to find out how your company can benefit from capacity and expertise in our flexible electronics factory.